When xp goes down don't reinstall, use this simple repair method..

When xp goes down don't reinstall, use this simple repair method...

The "it" in this case is XP's most powerful rebuild/repair option, and yet Microsoft chose to hide it behind seeming dead ends, red herrings, and a recycled interface that makes it hard to find and (at first) somewhat confusing to use.

But it's worth exploring because this option lets you completely and nondestructively rebuild, repair, or refre$h an existing XP installation while leaving already-installed software alone (no reinstallation needed!).
It also leaves user accounts, names, and passwords untouched and takes only a fraction of the time a full, from-scratch reinstall does.
And unlike a traditional full reinstall, this option doesn't leave you with two copies of XP on your hard drive.
Instead, you end up with just the original installation, but repaired, refre$hed, and ready to go.

When you're facing the prospects of a total reformat/reinstall, stop!
Try the no-reformat reinstall technique i'm about to illustrate, and you just may get your XP setup running again in a fraction of the time and with a fraction of the hassle of a grand wipe-and-restore.

The no-reformat reinstall operation starts with a normal boot from an XP setup CD

Start your PC with the setup CD in a drive, and hit a key when you see the following screen:


Boot from your XP setup CD to gain access to the no-reformat reinstall option.

If instead of booting to the CD your PC boots from the hard drive, you may need to modify your PC's "boot order."
It's easy and only takes a minute to make the change so that the PC will check for a bootable CD before trying to boot from the hard drive.

Once your PC starts to boot from the CD, you'll see something like what's shown in Screen 2:


Let the CD boot proceed normally and automatically through "Setup is inspecting your computer's hardware..." to the "Windows Setup" screen.

After a minute or two, you'll see the "Windows Setup/Setup is starting Windows" screen, shown in Screen Three.
Don't be alarmed:
It's still just the setup process running, and nothing's been changed on your PC yet.



The "Starting Windows" screen is a bit of an overstatement; it's just the setup process getting going.
Windows, as we normally think of it, isn't running yet, and no changes have been made to your PC.

Soon after Screen Three, you'll be presented with the normal "Welcome to Setup" screen, as shown in Screen Four.


The "Welcome to Setup" screen is poorly worded; the "Repair" option we want isn't the one explicitly offered here.
In fact, the repair option we want isn't shown at all.
See the text for full detail.

The poorly worded options in Screen Four lead many users astray.
The only mention of "Repair" here is "...repair a Windows XP installation using Recovery Console..." but that's not the no-reformat repair/reinstall we're seeking. (The Recovery Console Repair option is useful in its own right for fixing relatively minor problems with the operating system, and we fully explore it in the links listed above.)

The repair option we do want--a nondestructive, no-reformat reinstall--is actually hidden beneath the Setup option, "To set up Windows XP now, press ENTER."

So hit Enter, just as if you were setting up Windows afresh and from scratch.

The next screen, about licensing, gives no reassurances that you're on the right path for a nondestructive repair/reinstall--in fact, it's the same screen you see when you're setting XP up on a virgin hard drive.
But this is only the first of many screens that the Repair option will borrow from a full-blown setup.
Press F8 to accept the licensing terms and to go on.

Next, the XP setup process will show another screen that you may recall from your initial setup of XP. It searches for "a previous version of Microsoft Windows."
In our case, we're not replacing a previous version of Windows, but rather repairing the very same version that's on the setup CD--but that's OK; it's just another poorly worded screen.


Our intent is to repair the same version of Windows as is on the setup CD, but another poorly worded screen makes it seem like you're upgrading a previous version of Windows or installing one anew.
But don't let the bad wording alarm you; we're still on track for a nondestructive reinstall.

Screen Seven finally shows verbiage that's not recycled from the generic XP setup, but is specific to our Repair task.
Setup should find your damaged copy of XP and present it for repair, as shown:


At long last, Setup begins to refer to a Repair option. Here, Setup should have found your damaged XP setup, which you can select and then press R to start the nondestructive repair.

If your damaged copy of XP isn't highlighted in the list box, highlight it now. When it's selected, press R to start the repair process.

The Repair process then selectively deletes system files in the \Windows folder and subfolders and copies undamaged replacement files from the setup CD to their proper locations.



The Repair process then works on the current setup's Registry, leaving much of it intact and rebuilding the rest.


There's no fanfare, but this is one of the nicer parts of the Repair process: Setup retains what it can in the current Registry so that already-installed hardware and software will remain installed.

With the system files freshly copied and the Registry ready for rebuilding, the system needs to reboot.
Remove the CD from the drive so that the PC will boot to the hard drive instead of to the CD.

The first Repair reboot will take longer than normal.
Don't be alarmed. Also, don't be alarmed when Setup resumes.
Once again, it will appear that you're performing a full, from-scratch setup; there's nothing on-screen to indicate that you're repairing an existing version of XP.
But although the setup screens are the same as what you'd see in a full install, it's still a repair process, as will become clearer in a moment.

The first two of the Repair setup screens ask for your language preferences and product key.
Enter these normally.




When Setup resumes, it will appear that you're performing a full, from-scratch setup.
But don't worry--you're still indeed repairing your existing version of XP.

Many of the next few Repair screens will also be familiar.
The "installing devices" screen, for example, is identical to the one you normally see during a full, from-scratch setup.
But Repair is actually retaining much of the current setup's configuration and so will move through these steps faster than in a full setup.


The Repair version of the setup process skips or shortens many steps because it already has the information it needs from the existing setup.
For example, Repair's "installing devices" and the network setup steps are both much faster and require less user input than a new setup does.

The setup screens don't reflect the fact that a Repair proceeds much faster than a normal, full setup. In fact, the time estimates in the setup progress bar will be way off.
You'll be done in far less time than the progress bar predicts.



Just as with "installing devices," the network setup proceeds rapidly because Setup can re-use many of the configuration details from the current installation.
In fact, a Repair setup takes far less time than the installation progress bar indicates.

When this portion of the Repair is done, you'll see a "completing installation" screen:



The "completing installation" screen means most of the heavy lifting is done, and you're just minutes away from finishing the repair operation.

Setup then reboots your PC again, and this reboot will also take longer than usual. This is normal.

With the bulk of the repair work done, your PC needs to reboot once more and will do so automatically.
The reboot will take a bit longer than a standard boot, but this is normal.
After the reboot, you'll be brought to an abbreviated version of the "Welcome To Windows" setup pages.

You'll be asked if you want to register and--depending on how badly hosed the previous installation was--you may or may not be asked to reactivate the copy of Windows.
Next, the setup software handles the final networking details and then offers a "thank you" screen.


In most cases, the system will now reboot for a final time.
The Repair is done. It's a normal boot, bringing you to the normal choices for login.

With a final, fully normal reboot, you're done.
Your copy of XP should be as good as new, but with all your previously installed hardware, software, and user configuration data undamaged!


If all has gone as planned, you'll find all the user accounts and passwords intact, all the hardware devices set up as before, and all the previously installed software still installed and configured.
In fact, if all has gone as planned, the only significant change will be that whatever problem your copy of XP was previously experiencing will now be gone!

You now have a range of repair tools at your disposal, ranging from simple on-the-fly fixes such as Registry cleaning and safe Mode fixes to Recovery Console fixes, and, now, a nondestructive, no-reformat repair/rebuild option.

With this information, you should almost never have to face a dreaded start-over-from-scratch reformat/reinstall of XP!

How to lock a folder with a password without a software

Let me show you how to lock a folder without a software!

Steps:

1- make a new folder ( name it as you like )

2- inside this folder make a ( TXT ) file & copy inside it this (the entire thing)

Check Download Links Code:

Quote: Quote: cls @ECHO OFF title Folder Private if EXIST "Control Panel.{21EC2020-3AEA-1069-A2DD-08002B30309D}" goto UNLOCK if NOT EXIST Private goto MDLOCKER :CONFIRM echo Are you sure you want to lock the folder(Y/N) set/p "cho=>" if %cho%==Y goto LOCK if %cho%==y goto LOCK if %cho%==n goto END if %cho%==N goto END echo Invalid choice. goto CONFIRM :LOCK ren Private "Control Panel.{21EC2020-3AEA-1069-A2DD-08002B30309D}" attrib +h +s "Control Panel.{21EC2020-3AEA-1069-A2DD-08002B30309D}" echo Folder locked goto End :UNLOCK echo Enter password to unlock folder set/p "pass=>" if NOT %pass%== password here goto FAIL attrib -h -s "Control Panel.{21EC2020-3AEA-1069-A2DD-08002B30309D}" ren "Control Panel.{21EC2020-3AEA-1069-A2DD-08002B30309D}" Private echo Folder Unlocked successfully goto End :FAIL echo Invalid password goto end :MDLOCKER md Private echo Private created successfully goto End :End

3- After u copy the Commanding go to line 23 (or try using shortcut- CTRL+F and type password to locate the line) u will find this word : password here (Change it with any password u like.) is :

eg: if NOT %pass%== narnia1234 goto FAIL
//so ur password here becomes narnia1234 .//

4- After that go to ‘save as’ & name this file as "locker.bat "

5- Now back to the folder & u will find a ( LOCKER ) commanding.
(locker.exe)

6- Double Click on it & u will find a new folder (Private )

7- Ok ,, now copy what u want in this "private Folder" & after that come out of the folder, and Double click on locker again. It will open and ask if you want to lock your folder? Y/N ?

8- Type Y. your private folder will dissapear.

9- If you want to UNLOCK your folder ,go to (locker) & type your pass and you will see your private folder.

it not only hides the fodler, but incase, u unhide all files... and try opening it without entering password, it'l take u to the control panel...

Also, if u want to store files on your Pen-Drive, u can use this script. No Software Required

Incase u delete your Locker file (just in case), then u can make a new one (but with the same password) and open it from that.

Alternatively, u can keep this locker file somewhere else, and when u want to open ur folder, only then bring it back to that place ..

How to use bcdedit in windows 7

Below will give you a simple instruction about how to use bcdedit in windows 7.

1.Go to Start Menu-All Programs-Accessories,then right-click Command Prompt and select Run As Administrator,because Administrative privileges are required to use BCDEdit to modify BCD


2.Type bcdedit and press enter ,then bcdedit will show the boot entries on your computer

3.You can run bcdedit /? to see the manual of command bcdedit
-----------------------------------------------------------
C:\windows\system32>bcdedit /?

BCDEDIT - Boot Configuration Data Store Editor

The Bcdedit.exe command-line tool modifies the boot configuration data store.
The boot configuration data store contains boot configuration parameters and
controls how the operating system is booted. These parameters were previously
in the Boot.ini file (in BIOS-based operating systems) or in the nonvolatile
RAM entries (in Extensible Firmware Interface-based operating systems). You can
use Bcdedit.exe to add, delete, edit, and append entries in the boot
configuration data store.

For detailed command and option information, type bcdedit.exe /? . For
example, to display detailed information about the /createstore command, type:

bcdedit.exe /? /createstore

For an alphabetical list of topics in this help file, run "bcdedit /? TOPICS".

Commands that operate on a store
================================
/createstore Creates a new and empty boot configuration data store.
/export Exports the contents of the system store to a file. This file
can be used later to restore the state of the system store.
/import Restores the state of the system store using a backup file
created with the /export command.
/sysstore Sets the system store device (only affects EFI systems, does
not persist across reboots, and is only used in cases where
the system store device is ambiguous).

Commands that operate on entries in a store
===========================================
/copy Makes copies of entries in the store.
/create Creates new entries in the store.
/delete Deletes entries from the store.
/mirror Creates mirror of entries in the store.

Run bcdedit /? ID for information about identifiers used by these commands.

Commands that operate on entry options
======================================
/deletevalue Deletes entry options from the store.
/set Sets entry option values in the store.

Run bcdedit /? TYPES for a list of datatypes used by these commands.
Run bcdedit /? FORMATS for a list of valid data formats.

Commands that control output
============================
/enum Lists entries in the store.
/v Command-line option that displays entry identifiers in full,
rather than using names for well-known identifiers.
Use /v by itself as a command to display entry identifiers
in full for the ACTIVE type.

Running "bcdedit" by itself is equivalent to running "bcdedit /enum ACTIVE".

Commands that control the boot manager
======================================
/bootsequence Sets the one-time boot sequence for the boot manager.
/default Sets the default entry that the boot manager will use.
/displayorder Sets the order in which the boot manager displays the
multiboot menu.
/timeout Sets the boot manager time-out value.
/toolsdisplayorder Sets the order in which the boot manager displays
the tools menu.

Commands that control Emergency Management Services for a boot application
==========================================================================
/bootems Enables or disables Emergency Management Services
for a boot application.
/ems Enables or disables Emergency Management Services for an
operating system entry.
/emssettings Sets the global Emergency Management Services parameters.

Command that control debugging
==============================
/bootdebug Enables or disables boot debugging for a boot application.
/dbgsettings Sets the global debugger parameters.
/debug Enables or disables kernel debugging for an operating system
entry.
/hypervisorsettings Sets the hypervisor parameters.

C:\windows\system32>
-----------------------------------------------------------


4.How to changes the title of the boot menu entry.The following command change the title to Windows XP from “Earlier Windows Version”


-----------------------------------------------------------
C:\windows\system32>bcdedit /set {ntldr} description "Windows XP"
The operation completed successfully.
-----------------------------------------------------------


5.How to change the timeout on showing boot menu


-----------------------------------------------------------
C:\windows\system32>bcdedit /timeout 5
The operation completed successfully.
-----------------------------------------------------------


6.How to change the default OS to boot first with

-----------------------------------------------------------
C:\windows\system32>bcdedit /default {ntldr}
The operation completed successfully.
-----------------------------------------------------------

Attach file:

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windows_7_administrator_account.jpg (17.88 KB)


01.JPG (30.84 KB)

need driver

http://driverbyte.com/foxconn-n15235-vga-driver-onboard_freedownload/

Attack of the ANTs!

Yes, ants attacking my computers! You won’t believe this, but its the truth.

Summer heat forced “Ants” to think of a place cool and cozy, and they found a nice place in my computer chasis. They even penetrated the SATA PCB, fortunately surrendered before the real moving parts. Otherwise same thing would have happend as in last time. Reading head jamming! And if you open it ( assuming you are a newbie to HDD repairing ) you will be leaving with lots of extra screws and stuff, obviously ending the life of HDD. =)

After spraying with some liquid ( name was Copra) Ants moved away from chasis and now started making their home my logitech keyboard. Ants found the thin membrane edible and ate my letter “D, F & C” . ( Crap, how would I write Drink, Food and Cold ? )

Spraying continues …..

Now keyborad is clean and I managed to make it work.

Today : Ants are looking for a new place and they are wandering around my new LCD monitor. Being smarter than ever, I have already sprayed copra on it. Stupid ants

Spraying continues ….. [ Now I think people won't be entering my room, thats how it smells now ]

Using 5.1 PC Speakers as Home Theater Speakers

First of all I want to point out that PC speakers are compatible with DVD standalone, the only thing that does not allow this change is the pins used. PC system uses Stereo Pins while DVD system uses AV pins. If we can create another extra pair of wires to connect the differences, it can be used for both PC & DVD sysems.

5. 1 PC System
5.1 PC speakers uses 3 stereo pins and the channels are distributed as in the picture. Here two channels are carried using one stereo pin. Usually Front Left & Right in one ( green ), Rear Left & Right ( Black ), Center & Subwoofer ( Orange ).

5.1 DVD System
Uses 6 AV Pins and each carry single channel.

Now if you can connect one end with stereo pins and other end with AV Pins, the problem is solved. Just use your common sense and wire the connections.

Basic mobile phone repair tutorial

Section phone repair knowledge
1, fault classification
1, caused the causes of cell phone
(1), the menu settings failure: failure is not, strictly speaking, if no calls are perhaps for the owner to set up call forwarding; play no phone is set up outbound throttling. The baffling problem, first with total reset.
(2), using failure: improper operation generally refers to the user, dislocation caused by adjustment. More common are the following categories:
1), mechanical damage. As the operation or method of application of excessive force is not correct, resulting in mobile devices rupture, deformation, and the module pin loose weld failures and other causes. In addition, flip off axis, the antenna was broken and thrown split casing, water, broken screen, also belong to this type of failure.
2) improper use. When using the phone's keypad keys with the nail tip will cause the keyboard touch bare ground or even fall off; with bad cell phone charger will damage the internal charging circuit; even cause the accident; on the phone menu for illegal operation of certain functionality is turned off, the phone is not working; error led to SIM card password locked, the blind try to create self-locking SIM card protection.
3) improper maintenance. Cell phones are very sophisticated high-tech electronic products, use should be noted that in the dry, the temperature suitable for the use and storage environment.
4), the quality of failure. Some parallel imports of mobile phones is through consolidation, converted, quality underground. Although some phones are digital phones, but does not meet the GSM standard, can not be used.
2, fault classification
(1) does not dismantle the phone only to see its appearance from the mobile phone failure, can be divided into three categories:
1) The first one is not working, including the power supply can not turn connected to the phone and press the power switch without any reaction;
2) The second is not completely boot, press the handset switch current can be detected, but no switch machine normal reminder: if key lighting, display lights all bright, display, character information display with ringer After the start tone adopted by such self-test;
3) The third is to boot, but the failure of some functions, such as the buttons do not show unusual, silent, do not send it.
(2) open the phone, from a few core terms of its failure, also can be divided into three categories:
1) The first part of the supply charge and power failures;
2) The second for the mobile phone software fault;
3) The third part of the fault for the mobile transceiver.
Between the three types of failure was inextricably linked,
For example: impact of mobile phone software, power supply systems, send and receive path phase-locked loop circuit, the transmit power level control, send and receive time-synchronous control channel, and send and receive access to reference crystal oscillator has to provide software for mobile phones running the clock signal.
(To be continued, following more useful!)
Assignment: In the daily maintenance, to understand what factors lead to damage to the role? To understand the damage factors, should we do?
Second, the failure characteristics of common electronic components
Whether the breakdown of natural wear and tear or damage arising from man-made failures, generally attributed to the circuit contacts open, damage to electronic components and software failures of three failures. Contacts open, if it is a broken wire, disconnect the plug aside, poor contact, etc., generally easier to repair them. Damage electronic components, (except obviously burned and fever), often difficult with observers found that in many cases, have to rely on instruments to detect judge, so the maintenance staff, the first essential to understand the various devices effectiveness of the characteristics of this circuit fault for the maintenance, increase maintenance efficiency is extremely important, the following give some common characteristics of effective electronic components.
1, IC
Generally localized damage, such as breakdown, open circuit, short circuit, power amplifier chip easily damaged, prone to software failure memory, and other chips sometimes occur Weld.
2, transistor
Breakdown, open, serious leakage, parameter change bad.
3, diode (rectifier, LED, voltage regulator, variable volume).
Easily be puncture, open to larger forward resistance, reverse resistance becomes smaller.
4, resistance
Under normal circumstances, the resistance of the real efficiency is relatively low. However, the role of resistance in the circuit very important in some circuits, the resistance will change in the static transistor operating point changes, causing the entire unit circuit not working properly. Effectiveness of resistance effects are: loose soldering, resistance becomes larger or smaller, the temperature characteristic variation.
5, capacitor
Divided into two polarized electrolytic capacitors with non-polarized electrolytic capacitors. Electrolytic capacitor's effectiveness features are: short-circuit breakdown, leakage current increases, the capacity is decreased or the circuit. The Promise of the effectiveness of capacitance characteristics are: short circuit or loose soldering breakdown, leakage effects serious or resistance.
6, inductor
Effectiveness characteristics are: break, loose weld.
Above that are all the major components, there are also external components such as quartz crystal FET can not be ignored in the maintenance of the particular vulnerability of the crystal by the vibration and high-power devices (amplifiers, power supply circuit, voltage-controlled oscillator ) problems, there will be no boot or after boot can not access, can not hear other sounds, linked suppliers and other faults.
Operation:
1, the control of specific experience on the maintenance of books about integrated circuits, transistors, capacitors, resistors, inductors damage characteristics and failure caused by the phenomenon.
3. Troubleshooting steps
Mobile phone no matter what type of fault, must be asked, see, hear, touch, thought, the six stages of repair. But for different models, different faults, different maintenance methods for the six phases of time is different.
1, asked. , As doctor visits, as users must first understand some basic information, such as the cause of the failure process and the reasons for the use of cell phones, etc. age and the situation, such inquiries should be further face police attention and be thought to be clues.
2, see. Wide variety of mobile phones will inevitably encounter a number of their previous contact with the new model or models on the market less to see light of the specific models should be carried out, such as repair your phone, look at the green machine status indication LED lights are flashing, the call to allocate time information display, combined with the observed phenomena levy failure to provide ideas for further diagnosis.
3, listen. Can be repair mobile phone voice quality, volume situation, the sound is intermittent phenomena such as initial assessment levy failure.
4, touch. Mainly for power amplifiers, transistors, integrated circuits and certain components, hand touch can touch the surface temperature of the high and low, such as hot, may wonder whether current or overloading, you can roughly judge the experience base fault location.
5, thinking. The analysis of thinking. Root resist the previous observation, the data collected, used their service experience, combined with the specific principle of the circuit, using the necessary measurements, comprehensive analysis, thinking, and finally to maintenance programs.
6, revised. The components have been invalid for exchange, welding.
For the new phones because of defects in production process, fault movement in the case in many parts of the mechanical stress combined with near, and mostly poor welding parts, Weld and so caused. And fall, squeezing the damaged cell phones have in common fault, break something on the phone can be observed in the case the obvious mechanical damage, in the corresponding part of the movement is the key of the inspected part. The water and power supply caused by mobile phones have in common, water in the phone, if not in time, was oxidized over time, broken
Do not blindly carry out maintenance tests and be demolished power, wind welding components and circuit boards, it is easy to fault did not discharge the old results in new, can be simply restored to the original mobile phone becomes complicated.
Operation:
1, memories you go in the maintenance of the roundabout, do you think these methods help you repair it?
2, in the maintenance, application of these methods? Please be combined with practical thinking.
Fourth, the general process of mobile phone repair
1, the maintenance process
When receiving the fault plane should be done in accordance with the following procedures:
(1), after first understand hands. Get a machine for repairs, the first not to rush into action, it must first ask fault phenomena, the time and what happened anomalies. Observe the appearance of cell phones, with or without obvious cracks, defects, if there is no flip, antenna folded, the keyboard bald, and can largely determine the machine's fault, other ask what the machine is not water, two mobile phones, have taken place in other No, life is about how much use. For an excellent maintenance technicians, in asking about the process of failure, can largely determine the scope and cough can fault failure of components, so as to efficiently and quickly lay the groundwork for repairs.
(2) After the prosperity of Simple, easy things first.
(3) after the first power machine. To replace the power supply regulated power supply, note the voltage regulated power supply voltage with a multimeter to file to the correction, the source of the output regulator and the battery should be transferred to the same value, 7. 2V, 6V, 4. 8V, 3. 6V or other value. Block with the alligator clip to find the positive and negative battery terminal, together with regulators source, the source of the power supply voltage regulator circuit in series with high-precision multimeter. Look in the boot before the power output is not 0MA, if not, then the cell phone circuit of leakage.
(4) common problem after the first special.
(5) after the first and last class before the class.
(This section to be continued)
Key words: first after the hands-on understanding. After the first simple complicated, easy things first. First power supply, common problem after the machine first, then special. First and last stage, after the former level.
Assignment:
1, memories you go in the maintenance of the roundabout, do you think these methods help you repair it?
6) record failure. Types of faults do not forget to boot, water, falls, no display, dropping more than ten species, but each failure mechanism may occur much difference. Record failure to repair in order to clear objectives, so that between users and maintenance personnel have a certain determination.
(7) records phone models to be repair, IMEI code, MSN code. Every phone IMEI code and the name of MSN codes like mobile phones, so that the error does not occur when the handover.
(8) control the operation method of mobile phone for repairs. Repair cell phones do not use the phone, as the same as repairing a car will not drive a car, and some maintenance personnel on the operation of mobile phones is very vague on change ringing, changing vibrations, automatic timing, the last ten phone numbers display, call forwarding, check IMEI code, telephone directory function, the machine's display and modification of years on very strange, do not even know the meaning of phone status indicators: traffic lights that flash alternately calls, the service area flashing red light, green light flash within the scope of services. Operation can be adjusted out of the menu functions, it is impossible from the hardware maintenance solutions.
(9) did not fully grasp, do not repair phones when the user's face. Observed up to only disassemble in order to prevent tension caused by operator error.
Operation:
1, write a daily diary maintenance.
(10) carefully observe the circuit board. The failure observed with the eyes no longer detected by other means, such as integrated circuits work, should not result in a high temperature, if the hand does it feel hot, we can determine the initial internal short circuit phenomenon, word by direct observation, you can find some fault clues. However, direct determination, is built on the basis of past experience, not some maintenance experience, are not effective.
(11) plus electricity. In the above inspection, the boot power up to hit the amp output voltage regulator source file to see the power of the output is not the appropriate number of standby current, if not, then there must be trouble. Can check amplifier, leakage, software.
(12) to check the power path.
(13) check to receive access.
(14) to check input and output port, SIM card, ringing, keyboards, displays and other pathways.
(15) Charles emission pathway.
(16) points with a heat gun repair welding Weld.
(17) in the correct order of removal. Repairs, often to disassemble. In disassemble, should clarify its structure and location of components and accessories. Disassemble all the time clear screw fittings to connect position, when installed does not appear in the final dislocation.
(18) record maintenance log.
The daily maintenance log as is the doctor's case histories, what a day closing machinery, machinery for how long, check the phenomenon of what, how repair, whether repaired, have recorded. Do not repaired excited, think about how to solve the problem of taking those bends: no fix and do not be discouraged, analyze why there is no fix is found no cause of the malfunction? Can not be resolved or what? Later faced with this problem how do? This is a good way to improve self-learning.

MOBILE PHONE SERVICING- BGA CHIP REMOVAL GUIDE

BGA chip removal and welding
1. Guide
With the rapid global development of mobile communication technology, many handset makers compete to launch new compact and powerful mobile phones. In these new phones, the widespread adoption of advanced BGAIC (Balld arrays ball grid array package), which has spread the technology can significantly reduce the volume of mobile phone, enhancements, reduced power consumption, lower production costs. But, like all things beneficial to have disadvantages, BGA package IC is easy to fall caused by Weld, and to the maintenance work led to great difficulties.
BGA packaged chips are used precision optical instrument patch installed, error is 0.01mm, while the actual maintenance work, most of the repairs were not like the SMT equipment, even with all welding hot air and feel installation, little chance of success.
To properly replace a BGA chips, except with skilled use of hot air gun, BGA solder tool set but also must master certain skills and the correct method of dismantling welding. These methods and techniques to practice in the operation are described below
2. Operating
(1) BGA IC positioning
Before the demolition BGAIC must figure out the exact location of BGA-IC to facilitate welding to install. Some phone lines in the board pre-printed with BGA-IC positioning frame, the general orientation of this IC is not a problem of welding. Here, the main circuit board is not positioning box describes the case of IC positioning method.
Drawing a line positioning method. Before removing the pen or needles IC BGA-IC of the week week draw the line, remember the direction, make signs, prepare for the re-welding. Advantage of this method is accurate and easy strokes of the line defects is easily washed, draw lines with a needle if the efforts to master the bad circuit board easily hurt.
Stickers positioning method. Remove the BGA-IC before the four sides along the IC circuit board with a label affixed in the well, the edge of the paper with the edge of BGA-IC alignment, clamp the compacted cement. In this way, remove the IC, the circuit board on the left box label affixed good positioning. Reload IC, as long as several labels in front of the IC back into the space you can, pay attention to choose good quality adhesive label paper to paste stronger, so that can not be easily blown off during the reflow process. If you find a layer of thin paper label can not find the words feel, can be several layers of overlapping labels into a thick, cut with scissors to the edge of flat, paste it into the circuit board, it will be loaded back to feel a little better when IC .
Visual method. Demolition of BGA-IC before the IC first erected, then you can also see the IC and the circuit board pins, welding first compare the horizontal position, and then compare the vertical position welding. Remember the edge of the vertical and horizontal direction of IC and the circuit board on which lines and which components overlap or parallel, and then the results by visual reference to locate the IC.
(2) BGA-IC demolition
Recognize the BGA chip chip should be placed on top after the amount of flux, we can avoid dry winds, can help chip solder joints under uniform melt, will not harm adjacent components.
Remove hot air gun with a big head in front of the first set, the general transferred to the heat switch 3-4 stalls, stall speed the switch to 2-3 in chips about 2.5cm above the Department for spiral blow, until the bottom of the tin beads complete chip melting, tweezers gently hold up the entire chip.
Need to explain two things: First, the demolition BGAIC, we should observe whether the impact on surrounding components, such as the Motorola L2000 mobile phone, the demolition of character, it must remove the SIM card seat connector, otherwise, it is easy to blowing bad. Second, Motorola T2688, Samsung A188, Ericsson T28 of the amplifier and many soft-font package, BGA-IC temperature capabilities of these poor, hard blowing welding temperature is too high (should be controlled at 200 degrees below), otherwise, it is easy blow them bad.
BGA chip removed, the chip pad and the phone has more than tin plate, this time, in sufficient quantities in the circuit board with solder paste aids, electric soldering iron to remove the extra board, and can be properly on the tin so that each solder circuit board feet smooth rounded (not smoking tin solder suction line will be flat). And then use the thinner the chip and the board of the flux machine washed. Absorption should be particularly careful when tin, otherwise it will scratch pad and the pad off the top of the masking.
(3) seed tin operation
Do your homework. To remove the IC, IC is not recommended to remove the surface of the solder, as long as not too large, and the plant without affecting the steel with tin can, if large solder somewhere can help BGAIC surface with an appropriate amount of solder paste , electric soldering iron to solder IC's too big to remove (note best not to use suction to the suction line of tin, because the IC package for those soft fonts such as Motorola, if the suction line to suction, then tin will cause IC The welding pin indent the soft brown skin, posing difficulties on the tin), and then washed with water that day.
BGA-IC fixed. Alignment of the IC after planting holes in tin plate (note that if that side of the hole using a small planting hole big side of the tin plate, large hole side should be close to IC), with a label sticker to IC and tin plate plant Posts prison, IC aligned, put the tin plate plant by hand or forceps firmly fixed, and then paste on the other hand scraping tin.
On the tin paste. If the paste is too thin tin, blowing welding boiling lead into a ball on the easy difficulty, so the more dry solder paste as possible, as long as not doing hard into blocks can be made. If too thin, the pressure on the napkin can be a bit dry. Usually can pick a number of tin on tin pulp slurry to stamp a bottle and let it air dry a bit. Select appropriate level the sword with tin solder paste to the plant board, scraping down hard, scraping edge pressure side to solder paste evenly fill in the holes in the tin plate plant.
Note that special "care" about the four corners of the hole IC. Solder paste on the key when the tin plate plant to be pressed, if not pressed to make tin plate plant and the gap between IC, then the gap in the tin solder paste will affect the generation.
Welding blow into the ball. To remove hot air gun nozzle, the air volume to the minimum, will set the temperature to 330 - 340 degrees, which is 3-4 stalls. Huang nozzle tin plate plant slowly toward uniform heating, so slowly melting tin paste. When the individual saw the planting hole in the tin-plate solder has been generated, indicating the temperature has been in place, this time should raise the hot air gun nozzle, to avoid the temperature continues to rise. High temperature solder paste will make intense boiling, resulting in failure of plant tin; serious damage will make IC overheating.
If you blow into the ball weld, we found some uneven solder ball size, and even not planting on individual legs of tin, may be the first plant with a cutter along the surface of tin plate will be too large exposed part of the solder ball to level, then scraper the solder ball is too small and lack of foot hole in the tin covered with paste, and then again with hot air gun blowing once. If the solder ball size is also uneven, it can repeat the operation until the ideal state. Replanting must be set tin plate clean, dry.
(4) BGA-IC installation
First BGA-IC are coated with solder side of the foot solder paste amount of help, with a wind blowing hot air gun gently to help paste evenly distributed in the IC surface preparation for welding. Then plant a good solder ball BGA-IC position by position before the demolition into the circuit board, while the IC before and after hand or forceps and gently pressing move around, then you can feel both sides of the solder pin contacts . Because both sides are welded foot round, so if targeting a move back and forth, IC has a "summit of the hill climb" feeling, align it, because pre-painted in the IC's feet a little help solder paste, there is a certain viscosity, IC Wood moves. If the IC on the side, and to re-locate.
Be a good place BGA-IC, you can weld a. And the solder ball when planting, as the hot air gun nozzle to remove, adjust to the proper air flow and temperature, so that the central nozzle aligned IC's central location, slow heat. IC shocked when you see the solder paste and help around the overflow, indicating the solder and circuit board solder joints have been fused. Then you can gently rock full of hot air gun to heat evenly, due to surface tension, BGA-IC and the circuit board between the solder joints will be automatically aligned position, pay attention not to force the heated press and hold the BGA-IC, Otherwise, solder will spill, off the feet and are very vulnerable to short-circuit. Upon completion of welding the plate with the day that water can be cleaned.
Soldering BGA-IC in the wind, the temperature often affect the rubber seal next to some of IC, which often do not start such failure. Removed with a cell phone to cover the shielding cover is not effective, because your eyes shielded cover to resist, but can not stop the hot air. At this point, next to the IC in the top drop on a few drops of water will absorb heat evaporation is a lot of heat, as long as the water quit, next to the IC's temperature is maintained at safe temperature of 100 degrees, so as not to trouble the . Of course, you can also use heat tape to paste up the surrounding components or integrated circuits.

Third, treatment of common problems
1. No corresponding tin plate plant vegetation tin BGA-IC method
For some models of BGA-IC, do without this type of plant tin plate, may first try to hand the existing plants have tin plate and piece of BGA-IC pin spacing as welding, can be set get on, even if tin plate plant some feet away empty it does not matter, as long as can BGAIC feet planted in each solder ball can be, for example, the CPU and the Flash GD90 available 998CPU and power IC's tin plate plant to apply .
2. Glial fixed BGAIC the cannibalize method
Many phone BGA-IC fixation methods used gum, this gum is difficult to deal with, very difficult to remove BGAIC, here are several common methods for the demolition of reference.
(1) Motorola mobile phones with bottom glue BGA-IC, with the current number of brands on the market is basically the glue can be up to par. The experiment found that banana water (paint thinner) soaking is better, just soak 3 to 4 hours you can remove the BGA-IC.
(2) Some mobile phone's BGA-IC is the end of glue 502 glue (such as the Nokia 8810 mobile phone), the use of blowing hot air welding gun, you can smell the smell of 502, well soaked with acetone.
(3) Some Nokia mobile phones for the end of a special plastic injection molding, incomparably better dissolve the current method of demolition should pay attention to the demolition skills, underfill and solder due to thermal expansion is not the same degree and often do not melt plastic solder the first inflated. Therefore, the blowing welding, hot air gun thermostat should not be too high, while in blowing welding, tweezers, press a little hard, you will find BGA-IC solder beads surrounded by a spill, indicating the weight of an effective, almost blown when you can translation look BGA-IC, if peace movement, shows that the bottom had been melting, then the BGA-IC exposing them relatively safe.
It must be explained: the Motorola V998 phone, soaked to remove the former must take the character, otherwise the character will be damaged. Because the V998's character is a soft package BGA, can not use banana oil, thinners or sol blisters. Because these solvents on the soft seal in plastic BGA font strong corrosive plastic expansion will lead to Fonts scrapped.
3. PCB stripping approach
For example, in replacement of V998 of the CPU, remove the CPU are likely to find the green circuit board solder layer stripping phenomenon, reinstall CPU-current fault occurs after the mobile phone, hand-to-hot CPU have signs. CPU solder layer must be destroyed following reasons, re-solder CPU short circuit occurred.
This phenomenon desoldering V998's CPU, it is common, the main reason is lack of time soaking solvent, there is no bubble through. Also remove the CPU in time, to side with the hot wind, while the surface of tweezers in the CPU to fully tap the various parts, so that the prevention of PCB circuit board solder stripping and broken legs, a very good prevention.
In the event of a "stripping" phenomenon, can go to the production of printed circuit board manufacturers to find a dedicated solder (commonly known as "green oil") smear in the "stripping" of the place, let it dry slightly, with a soldering iron to solder circuit board little can be welded on to open a new CPU. In addition, we bought in the market of the CPU on the original package solder balls are relatively large and easy to cause a short circuit, and we do use tin plate plants are smaller solder balls. The original adoption of the solder balls can be removed, then re-plant tin filled to the circuit board, it is not prone to short circuit.
4. Solder joints broken foot treatment
Many mobile phones, as wrestling or demolition do not pay attention, is likely to result BGA-IC circuit board solder joints under the broken legs. At this point, circuit boards should first be put under the microscope, to determine which is the empty legs, which is indeed broken. If you only see a smooth bottom of the "fossa", next to no line extension, which is empty legs can not do care; if broken legs next to the bottom line extension or side-track, the burr, is not illustrate the point empty legs, according to these methods remediation.
(1) connection method
For the next to extend the breakpoint line, you can use a knife to gently scratch the line next to that, spend enough tin enameled (enameled wire should not be too thin or too thick, such as too small, then reload BGA-IC enameled easy to move when bit) one end of the welding line next to the breakpoint, one end of the extension to the breakpoint location;
For the sandwich to the circuit board to the breakpoint, you can gently under the microscope with a needle to the breakpoint in the digging, dug the roots of highlights after the break, carefully solder a short wire with out. All after the break with a good line, carefully place the BGA IC soldering.
(2) fly line method
The connection method for the difficulties with breakpoints, first of all you can access information and more normal way to determine the board is where access to the circuit board, and then use a very fine enameled wire soldered to the BGA-IC corresponding solder ball. Welding method is to have solder ball BGA-IC side facing up, with a hot air gun blowing heat, it will insert one end of magnet wire solder balls, and the line after the line leads to the gap along the solder ball, turn to the opposite IC Heat the sticker with a fixed and ready welding. Carefully weld, IC cooling, and then leads the line of welding to pre-position look good.
(3) seed ball
For there is no line that extends around the breakpoints, we gently under the microscope with a needle digging, to see bright spots, the use of needle dig a little when we used tin tin plant pulp on top, with a small fine, blowing hot air gun into a ball, if the solder does not fall with a small brush, brush lightly, or control data measurements confirmed a good solder joint has indeed received. Note that the board slightly larger solder balls to do that, if done too little in the welding on the BGA-IC, the board will be IC solder balls on the solder ball to attract in the past and come to naught.
5. Board approach to blister
Sometimes demolition BGA-IC, because the temperature of hot air gun control is not good, resulting in BGA-IC circuit board under the blistering uplift because of overheating. Generally speaking, most will not cause foaming and overheating disconnection, maintenance as long as cleverly weld the above BGA-IC, mobile phones will be able to function properly. Maintenance can use the following three measures:
(1) flatten the circuit board. Hot air gun will be transferred to the appropriate temperature and light wind blowing circuit boards, the back edge blowing Gently press edges to clamp the line into part of the Long board, make it as smooth 1:00.
(2) IC plant on top of a large solder ball. No matter how circuit boards, lines are not completely flat, we need to plant into a larger IC, solder balls easy to adapt to the rugged circuit board welding, we can take two pieces of the same plant and with the use of tin plate Tape cement, and then a piece of "thickening" of the plant to plant tin tin plate. Good tin plant will find difficult to remove the IC, this time not to rush to remove, can be coated in tin plate plant paste a little help, will tin plate plant overhead, IC down, gently blowing with hot air gun, IC solder will melt and the easy separation of tin plate plant.
(3) In order to prevent the solder on the BGA-IC circuit board when the original blister Office has also uplifted by the high temperature, we can install the IC when the circuit board in the opposite mat a sponge absorbing enough water, so too can avoid the circuit board temperature high.

Reform yourself making mobile phone charger, USB data cable and headset

Reform yourself making mobile phone charger, USB data cable and headphones

Many reasons made cell phones for models, charger, USB data cable and earphones since the original machine can not buy the charger cable and headset, to tell you here yourself, use the other line conversion method: This method is suitable for a certain practical ability of the machine friendly, if a novice, it is recommended not to do the same action! Many domestic phone because the model because, charger, USB data cable and earphones after the original machine can not buy the charger cable and headset, to tell you here yourself, with other line conversion method: this method is suitable for a certain Friends of practical ability of the machine, if a novice, it is recommended not to do the same action!

Tools ready: Tools to prepare:

1, multimeter a 1, a multimeter
2: The full line phone socket pin plug a 2: The full line phone socket pin plug 1
3: The maintenance of a power table (need short-circuit protection) 3: The maintenance of a power table (need short-circuit protection)


Specific steps: Specific steps:


First, find the GND line measurement is the earth! Ground the negative battery terminals and the general line of metal parts. First, find the GND line measurement is the earth! Ground generally negative and the line connected the battery part of the metal shell.

1: first data plug the phone socket. 1: first data plugs into the phone socket.

2: Insert the phone jack from the plug on the measured and the phone line GND (ground) line, and make their own records (pin algorithm depends on the individual) 2: Insert the phone jack from the plug on the measured and the phone line GND (ground) line, and make their own records (pin algorithm depends on the individual)

3: GND from the plug on the line leads to a line, the power supply line of the table GND GND line connected to the plug. 3: GND from the plug on the line leads to a line, the power supply line of the table GND GND line connected to the plug.


Second, find the charge measurement of foot Second, charging feet measured to find out


This is the way to do chargers, chargers, brand-name computers adapters please use the output voltage of 5V - 500MA of the change. Other error: the first table to adjust the power voltage 4.5 ~ 5.0V, the phone battery and boot, and then table with the power plug point cathode forceps head pin on each data line (GND Line) when they heard a beep sound while on the phone screen display when the charger is connected to this pin for the charge that line into, release Photo neutrons beep cell phone screen while the charger has been removed, the charge lines into the foot is generally two or three lines connected to a small number as a separate existence of good records at this time XX pin (charging feet). This is the way to do chargers, chargers, brand-name computers, please use the output voltage of AC adapter 5V - 500MA of the change. Other error: adjusting the power supply voltage table 4.5 ~ 5.0V, mobile phone battery and boot, and then table with the power plug point cathode forceps head pin on each data line (GND Line) when they heard a beep sound while on the phone screen display when the charger is connected to this pin for the charge that line into, release Photo neutrons beep cell phone screen while the charger has been removed, charging into the line is generally two feet or three lines connected to a small number as a separate existence, then good records XX pin (charging feet).


Third, measurement start line and find the USB D + D-line Third, measurement start line and find the USB D + D-Line


Ibid method, the positive power supply form interface forceps touch other pins, caused when the touch screen mobile phone will enter the U disk mode, make records of the feet, continue to touch down, when the mobile phone screen displayed again will enter the U disk mode again, make records, they continue to touch down, when the mobile phone screen prompts to enter the third U disk mode, make the same record, when measurement is completed. Ibid method, the positive power supply form interface forceps touch other pins, caused when the touch screen mobile phone will enter the U disk mode, make records of the feet, continue to touch down, when the mobile phone screen displayed again will enter the U disk mode again, make records, they continue to touch down, when the mobile phone screen prompts to enter the third U disk mode, make the same record, when measurement is completed.


Connect the data cable Connect the data cable pin pin

Number of law USB cable: 2 square hole facing up against the computer USB interface. Left U1 - Power, U2 - D-U3 - D + U4 - Ground Number of law USB cable: 2 square hole facing up against the computer USB interface. Left U1 - Power, U2 - D-U3 - D + U4 - Ground


Measured separation of the final step into the line U disk mode, in which two of 1,2,3 definitely separated between the neighbors, and these two were near the line separated by the inclusion of the USBD + and USBD-. Separate the last step into the measurement of the line U disk mode, which definitely 1,2,3 between two of the neighboring apart, these two were near the line separated by the inclusion of the USBD + and USBD-.


Another line for the USB BOOT (USB activation line) will activate the pin and USB charging pin is connected to USB power cable (that is, + U1 - power supply) Another line for the USB BOOT (USB activation line) will activate the pin and USB charging pin is connected to USB power cable (that is, + U1 - Power)

GND = computer's USB mobile phone interface to the GND line U4 - ground GND = computer's USB mobile phone interface to the GND line U4 - ground

Mobile phone charging pin USB BOOT = computer USB interface to the B + line U1 - Supply Mobile phone charging pin USB BOOT = computer USB interface to the B + line U1 - Power Supply

The two adjacent lines into the U disk mode D + = USB interface and the D-line The two adjacent lines into the U disk mode = USB interface cable D + and D-

Interfaces with the USB cable connected and lead after the phone off insert the USB plug end into the computer, if the lower right corner of the computer screen prompt new hardware found, USB download cable made the whole process is completed Interface with the USB cable connected and lead after the phone off insert the USB plug end into the computer, if the lower right corner of the computer screen when prompted to find new hardware, USB download cable made the whole process is completed

If the computer screen prompts lower solutions do not recognize the USB device, please interfaces D + D-lines are inserted again after the data exchange line to the computer's USB socket on the bottom right corner of the computer screen prompts found new hardware, that done to correct process. If the computer screen do not recognize the next solution prompted USB device please interfaces D + D-lines are inserted again after the data exchange line to the computer's USB socket on the bottom right corner of the computer screen prompts found new hardware, that done to correct process.


4, headset Making 4, headset Making


Identify cell phone handsfree headset line pin: Ground, Headset feet, give it legs, the left channel headphone foot, right foot channel headphones. Identify cell phone hands-free headset line pins: ground, pin headset mode, send it legs, the left channel headphone foot, right foot channel headphones.

1, measured mobile ground. 1, measured mobile ground. Multimeter measured on the ground. Multimeter measured on the ground.

2, Headset feet. 2, Headset feet. Phone is switched on, headset mode pin and ground shorted cell phone screen will appear when the icon or prompt a headset headset is connected. Phone is switched on, headset mode pin and ground shorted cell phone screen will appear when the icon or prompt a headset headset is connected.

3, ground and headset mode pin shorted to ground receiving these headphones shorted the pins on. 3, ground and headset mode pin shorted to ground receiving these headphones shorted the pins on. Then the emergence of a headset phone screen icon. At this time a mobile phone screen will appear headset icon.

4, call 13800138000 or play MP3, to the left channel headphone line-by-foot examination until the end of the sound on the pin and then solder the other one the same way as the right channel headphone cable. 4, call 13800138000 or play MP3, to the left channel headphone line-by-foot sound trial until the end of the pin and then solder the other one as the right channel headphone line method.

5, make calls, send it with a line-by-foot examination until the other party can hear the voice of welding on the telephone line will be sent. 5, make calls, send it with a line-by-foot examination until the other party can hear the voice of welding on the telephone line will be sent. Or looking for a 1.3 --- 1.8V voltage feet Or find a 1.3 - - 1.8V voltage pin

MTK mobile phone charger make the most simple, because 6305 feet is charged the first leg. So the amount of which it and insert the end of the same foot which is the positive terminal of the charger. MTK mobile phone charger make the most simple, because 6305 feet is charged the first leg. So the amount of which it and insert the end of the same foot which is the positive termina

Laptop power supply principle and not the fault of

Notebook without power fault conditions in several ways, namely:
First, use the adapter without electricity, but the use of battery power-normal;
Second, use the adapter power-normal, but without using battery power;
Third, use the adapter and the battery can not power up.
The three failures are very common in notebook computers, in order to maintain the three failures, must have the laptop power-up process. The following simple analysis of the notebook's power-process.
When we press the power switch after the low (or high) of PWRSW # signal triggered PC87591, PC87591 and then issued a PM-PWRBTN # signals trigger the ICH, ICH back to laptop mode PC87591 three signals (Figure in step 6), and then the main power supply notebook computers to trigger the switch, such as the main power supply, CPU power supply, etc., and then follow the steps in the diagram in power. As shown.





AC IN is the adapter's power supply, Battery is the main battery power supply, the figure of the Always ON will be output as long as regular plug in the power supply, the figure of the main power supply chip (SoC is the MAX1632, there needs Note that the circuit is simply plug in the power picture will appear after the third step of the power supply, commonly known as standby power, the standby power output after the notebook is not available to some of the main power supply, laptop power supply also need to map the main The I / O PC87591 chip can drive after the standby power supply the main power supply to the laptop. The main supply-driven approach is one of a kind of notebook, there is a situation that is plug in the power system chip in the future will not produce standby power the need to drive system-chip to generate the system main power supply, the current notebook computer system main power supply both coexist.
The above principle of analyzing the power supply after the notebook, the following circuit, and in light of the failure phenomena of the previous failure analysis.
First, use the adapter without electricity, but the use of battery power-adapter power-normal or normal use, but without using battery power. Both fault detection is required for maintenance of two separate circuit protection, the figure close to the adapter and two battery box circuit, this circuit mainly consists of two separate component of insurance, MOS tube and diode. This part of the insurance is the most easily damaged, then MOS pipe, there is the diode. Encountered two separate circuits to detect the first failure of insurance, MOS tube, then is a diode, so that we can basically find faulty.
Second, use the adapter and the battery can not power up. In such failures, we are here to tell you that in accordance with the principles of analysis were used. In such fault detection process is as follows:
1, testing the main board about whether the short-circuit power supply part of the phenomenon;
2, detection of CPU power or the CPU is normal, because some machines can also cause CPU failure in power;
3, the main testing system chips power supply output is normal, if you do not need to confirm the normal output of the circuit is normal, the output circuit is mainly MOS tube and diode are normal;
4, detection system chip input power conditions, including the main power supply, etc.; detected a problem with the input circuit should carefully test the input circuit, in particular input circuits in the insurance and MOS is the most easily damaged.
In summary, the failure of laptop power failure is very common, such as voltage instability caused by prolonged use of the aging device, circuit design, current shocks can cause a power failure. If you encounter this failure to open the laptop in the case, according to the aboveprocess can be detected.

ATX power supply repair tips

Failure phenomenon, no output measured and found to plug 9 feet No +5 vsb voltage, so you can not judge the work of auxiliary power.
Ic3 l7805 three-terminal regulator measuring inputs and outputs were not voltage, but sometimes there is 20v input voltage, output has 5v voltage, then short the normal voltage output pin 13-14, but then again, the short cable disconnect pass the time nor the output voltage. Auxiliary power collector voltage measurement from the multimeter instructions have been found from vibration, it was suspected that a fault in the transformer secondary winding side。 Replacement capacitor c04, disconnect l7805 input, still no voltage secondary winding, again in accordance with the power failure did not come from the vibration of the end winding from the initial search fails, found that when the switch with a multimeter measuring the collector, the voltage times be back to normal and the enhanced effect by vibration is not to find fault confidence.
Survey found that r02 has become infinite resistance, the role of this resistance is filtered rectified mains voltage into the base switch is open power from the vibration produced a prerequisite, with a 390k resistor to replace r02, troubleshooting .
IC Application Circuit Diagrams way radio equipment, integrated circuits, more and more applications, knowledge of the IC application circuit is a circuit diagram of a key, is one of the difficulties.
1. IC application circuit Application circuit function has the following features:
① It expresses the integrated circuit structure outside the pins, components and other parameters, so that the work of a complete integrated circuit.
② Some IC application circuit, draw a block diagram of the circuit within the integrated circuit, this time on the analysis of IC application circuit is very convenient, but that means little.
③ IC application circuit is a typical application circuit and functional circuit of the former manual can be found in integrated circuits, which appear in the practical circuit, these two little difference between the application circuit, according to this characteristic, in the absence of actual Typical application circuit Application circuit can be used for reference, this method is often used in repair.
④ general expression of IC application circuit unit, a complete circuit, or a circuit system, but in some cases a complete circuit to use two or more integrated circuits.
2. Characteristics of IC application circuit IC application circuit has the following features:
① most of the application circuit does not draw within the circuit block diagram, which is detrimental to knowledge map, especially for beginners to more unfavorable circuit analysis.
② For starters, the application of integrated circuit than the circuit of discrete components is more difficult, which is the internal circuitry of IC do not know the original edge, in fact, in map Ye Hao, repair Ye Hao, integrated circuits more convenient discrete circuit components.
③ on the IC application circuit, the general understanding of the internal circuits and integrated circuits Learn more about the role of the lead case, the knowledge map is more convenient. This is because the circuit has the same type of regularity in their common master, you can easily analyze many different types of integrated circuits with feature application circuit.
3. IC Application Circuit Diagrams methods and attention of IC methods and precautions are mainly the following points:
(1) to understand the role of each pin is the key to understand the knowledge map the role of pin IC application can access the manual。 Know the role of each pin, the analysis of the external circuit pin role of the working principle and components convenience. For example: know the pin is an input pin ①, foot and then the series is the input coupling capacitor circuit, and the circuit is connected to pin ① input circuit.
(2) to understand the role of integrated circuit the pins are three ways to understand the role of IC pins, there are three different ways: First, access to such information; 2 is based on the internal circuit block diagram of integrated circuits; 3 is based on the application of integrated circuit outside of each pin of the circuit characteristics. On the third approach requires a relatively good basis for circuit analysis.
(3) integrated circuit analysis step of the application circuit as follows:
① DC circuit analysis. This step is mainly for power and ground pins outside the circuit. Note: there are multiple power supply pins when the power to distinguish between these, such as whether the former level, after the power supply circuit of pins, or the left and right channel power supply pin; on a number of ground This pin must distinguish. Distinguish between multiple power pins and ground pins on the repair is useful.
② Analysis of signal transmission. This step analyzes the signal input pin and output pin external circuit. When the IC has multiple input and output pins, we should be clear after the previous level, or circuit of output pins; for two-channel circuit also distinguish between left and right channel input and output pins.
③ other pins of the external circuit. For example, to find negative feedback pin, pin, etc. of vibration, this step of the analysis is the most difficult, on the beginner to the role of information by means of pins or internal circuit block diagram.
④ have a certain ability in knowledge map, learn to summarize various features of integrated circuit pin external circuit law, and to master the rules, which enhance the speed of knowledge map is useful.。 For example, the input pins outside the law of the circuit is: through a coupling capacitor or a coupling circuit with the output stage circuit is connected; output pins outside the law of the circuit is: through a coupling circuit and the circuit after the input stage is connected.
⑤ analysis of integrated circuits within the circuit of the signal amplification process, the best access to the internal circuit block diagram of the integrated circuit. Within a block diagram of the circuit when the signal transmission lines through the arrows to know which circuit after the signal amplification or processing, the final signal output from which pin.
⑥ understand some of the key integrated circuit test points, pin DC voltage law on the maintenance of the circuit is very useful.０ｖ。 otl circuit DC voltage output DC voltage equal to half of IC; ocl circuit DC output voltage is equal to 0v; btl circuit DC output voltage of the two are equal, when a single power supply voltage is equal to half the DC, dual power When power is equal to 0v. When the two pins of the IC indirectly resistance, the resistance will affect the two pin on the DC voltage; When the two pins of the coil indirectly, the two pin DC voltage is equal, Unequal coil will be open up; when two pins of a capacitor or indirectly connected rc series circuit, the two pins of the DC voltage is certainly not equal, if the same breakdown shows that the capacitor has been.
⑦ generally not to analyze the integrated circuit within the circuit works, it is quite complex.
1. Blown fuse fault analysis and for this failure, the first turn on the power case, inspection of the fuse blown power supply, whereby the inverter circuit can determine whether the initial failure occurred. c5、c6,ql、q2, If so, the following three conditions are not caused by external: input circuit is a bridge rectifier diode breakdown; high-pressure filter electrolytic capacitor c5, c6 are breakdown; inverter power switch ql, q2 damage.
The main reason is because the DC filter and transform oscillator circuit to work long hours in high pressure (10 300v), high current state, especially because of large changes in AC voltage output when the load heavy, prone to blown fuse fault.。 DC filter circuit consists of four rectifier diodes, two 100kω about limiting resistor and two electrolytic capacitor 330uf about the composition; transform oscillation circuit is mainly installed in the same heat sink on the same two models of high-power switch tube.
AC fuse blows, disconnect the power plug off, the first circuit board carefully observed the appearance of the high-voltage components have been burnt or breakdown traces of electrolyte overflow。 Without exception, with a multimeter measuring the value of the input: If less than 2ookω, shows a partial short circuit back then were measured at two high-power switch e, c resistance among most; if less than 100kω, it indicates switch tube has been damaged, measuring four rectifier diodes are reverse current limiting resistor and the resistance of two, with a multimeter to measure the charge and discharge conditions to determine whether it is normal.。 Also when replacing the switch, if you can not find the same models to choose alternative products, we should pay attention to the collector - emitter reverse breakdown voltage vceo, the maximum allowable collector power dissipation pcm, the collector - base hit reverse through voltage vcbo parameter should be greater than or equal to the original transistor parameters.。 Another to note is that: a component must not be damaged in the identified, direct boot after change, so may still have trouble due to other high voltage components, in turn replace the damaged components.。 Must be on the circuit conduct a comprehensive inspection of all high voltage components measured, the failure to completely rule out the fuse blows.
2. No DC voltage output or voltage output instability if the fuse was intact, in a load case, no output DC voltage levels, the possible reasons are: power appears open, short circuit; over-voltage, over-current protection circuit failure; oscillation circuit did not work; power supply overload; high frequency rectifier diode rectifier filter circuit, the breakdown; filter capacitor leakage, etc..
Processing methods; with a multimeter measuring system board 10 5v power supply to ground resistance, if more than 0.8ω, it indicates the system board without short circuit. The computer configuration to minimize the machine, leaving only the motherboard, power supply, buzzer, measuring the output DC voltage, if still no output, indicating a fault in the computer power supply control circuit。 Controlled mainly by the integrated circuit switching power supply controller (tl-496, gs3424, etc.) and over-voltage protection circuit, the control circuit is working properly is directly related to whether the output DC voltage. Over-voltage protection circuit composed of small-power transistor, or silicon and related components, whether used multimeter measuring the breakdown of the transistor (SCR Zexu welding if measured), the related resistors and capacitors for damage.
3．Power supply output, but no show boot failure may occur due to power good signal input of the reset delay time is not enough, or no power good output.
When turned on, with the voltage meter measured the output power good (then host of a pin power plug), if no +5 v output, then check the delay components; if +5 v output, then change the delay capacitor delay circuit can.
4 Poor power supply load with only the motherboard, floppy drive power when working, when connected to the hard drive, optical drive, or plug in memory, the screen changes from and does not work. The possible reasons are: the transistor operating point is not a good choice, high-voltage filter capacitor leakage or damage, leakage heat regulator diode, rectifier diode failures.
The exchange oscillation circuit transistors to increase the gain, or transfer large transistor operating point. Detected a problem with a multimeter components, the replacement of silicon, zener diodes, high voltage filter capacitor or rectifier diode can be.
1-Today, a Big Dipper repaired power, failure to start the board can not, short access test points, power supply fan will be transferred, amount of voltage output of each group completely normal, but listen to say a word internally, apart found that the filter capacitor 12v bubbling, replacement after work.
2。Recently, repair a colorful (umax) power supply, this is the case, the fault is not power, turn on the power enclosure and found broken glass fuse has instructions within the current large, there is short-circuit point, when I opened the bottom found a small cockroach stick died in boards, and the power of the steel substrate has burned black, the circuit board with melt point circuit board, the first volume of a few power management, good, take a closer, a small cockroach just died in the power supply filter capacitor The 300v both ends, with anhydrous alcohol to clean the circuit board, the measured power input part of the rectifier diodes, four on bad. This is not easy to find the same type of rectifier diodes (this stuff used must be of the same model, or soon will be bad), then a rectifier bridge to find a replacement as usual.
3, lenovo original ps-400atx power, boot no reaction, test +5 vsb is 6.7v, pwon to 3.4v, but the insurance and switch to normal observation center to promote the transformer primary winding circuit of a resistor r11 burned black, the resistance of the Deputy Power Supply +13.8 v supply for the two to promote the transistor c9015 limiting resistor, check similar circuit, the replacement for the 1.5k resistor tl494 color, measuring +5 v reference output 8.4v, the bad block replacement. ＋5vsb+5 Vsb filter capacitor (16v, 470uf) muster, replacement. Vice-power opt coupler in the secondary output current limiting resistor r33 (2.7k) circuit, replace the normal power. Analysis of failure causes for the resistance r33 higher open circuit voltage caused by the Deputy damage caused by a string device.

MOTHERBOARD REPAIRING STEPS

MOTHERBOARD

maintenance information

Repair parts
Do not turn fault detection method and sequence
1. Check the working conditions of the three CPU
l Power Supply
l clock
l Reset
2. Remove the BIOS chip select pin 22 check whether the signal transition
3. Test for BIOS, search the line connected with the BIOS
4. Charles ISA, PCI, on the data lines, address lines (and AD), interrupt and other control lines (this can be a direct reflection of north and south bridge problem)
5. Charles AGP, PCI, CPU Block North Bridge on the way to determine whether the normal resistance
l CPU core voltage power supply
2 FET bad, open or short circuit
2 short-circuit filter capacitor (electrolytic capacitor)
2, no output voltage IC
No 12V power supply
voltage IC bad
Break
2 CPU voltage related to minor short circuit
2 bad of a field effect transistor, the output voltage becomes lower
2, no effect on the feedback circuit
2 Output voltage and low voltage IC
l VID 0-4, (+5 V voltage)
2, no output voltage IC
2 and the exclusion bad CPU Blocks
2 Break
l VTT 1.5V
2 bad power FET
2 VTT1.5V a right to short-circuit
2 FET power supply is not normal
2 FET bad
l clock
2 CPU Clock Tower and the open circuit between IC
2, no output clock IC
2 and output filter capacitor connected to the bad (10 PF)
2 power supply is normal 3.3V 2.8V 2.5V
2 All no output or no output half
2 from the crystal oscillator 22 is to determine if the bad skin
2 have electricity, IC bad
2, no power, check supply the relevant line
2 IC bad
2 half check for abnormal
l Reset
Low Voltage Reset 2: Bad Northbridge
2 There was no reset voltage
? North Bridge North Bridge without welding or reset false
? Disconnect the line connected with the North Bridge

2 are reset: continuous line with the North Bridge
2 No Reset: Reset generation circuit check


Boot display and related failures to judge
1. Display the information and memory card capacity
2. Shows the motherboard model, manufacture date, BIOS version of the content
3. Shows the main frequency of CPU, (FSB and multiplier)
1) CPU Block bad
2) Jumper Settings Error
3) North Bridge and CPU line between Block
4. Memory capacity
1) bad memory
2) bad memory slot
3) Northbridge bad
4) memory slots poor contact
5. IDE interface status
1) not detected
i. signal line and the hard disk, CD-ROM
ii. IDE Interface needle
iii. Southbridge bad break
2) detection of errors
i. hard drive, optical drive signal line
ii. IDE interface issues
iii. Southbridge bad
iv. Clear CMOS
6. Floppy
1) Setting error
2) signal line and the floppy drive
3) Floppy Interface
4) I / O bad
5) South Bridge bad
7. Keyboard, mouse
1) The keyboard, mouse, bad
2) The relevant line (exclusion, inclusion and exclusion, inductors, resistors, I / O)
3) keyboard lock (CMOS, keyboard lock-related lines)
4) South Bridge, or to break or short circuit between the South Bridge
8. Sound card
1) not detected
i. CMOS off (clear CMOS)
ii. sound card and crystal (no waveform voltage one high and one low)
iii. Supply (78L05)
2) noise
i. input power supply filter capacitor
ii. the output filter capacitor
iii. sound bad
iv. Southbridge bad
9. USB, COM ports, printer port, game port
1) interface bad
2) The power supply is not normal
3) signal line in question
4) I / O or the South Bridge


Memory-related failure to judge
1. Read less memory
? Slot bad
a) bad shrapnel Contact: oxidation, stretch out of control, open
b) short circuit burned out groove: two-pin short circuit, damaged
? Memory-related lines: one slot short circuit; power supply; clock; ranks gating; lines are open; data line; address line; control line; Northbridge bad (most of the relevant line with the North Bridge)
2. Digital jump incomplete
C0-C1-C3-C5 (no C3 and C5, are related to line problems)
3. Memory error
? Memory bad
? Access to good
? Slot problem with the line between the North Bridge
4. Into 98 missing characters: the bad memory
5. After the crash into the 98: the bad memory
6. AGP slot short circuit - effect Northbridge, RAM
7. BIOS error or data loss
? Virus infection
? Upgrade fails
? Power supply does not
Note: The clock IC are sometimes not read memory
Diagnosis of Different motherboards have different number of cards to go, often have the following three kinds:
1:00-C0-C1-C3-0b-0d-3d-42-6F-7F-FF
2: FF-C1-1d-2b-3d-42-6F-7F-FF
3: FF-d3-d4-0b-2A-31-3d-4E
Sound Card Trouble
1. Power Supply
78L05 12V power outlet to the three-terminal regulator input pin, the output is 5V voltage to the IC card
2. IC card to work should be hot
1-12 feet which is more important, including the power supply, crystal oscillator, two feet, the control signal
3. Crystal
24.576MHz, next to two small capacitor 22PF
? Have a power waveform
? Into the 98 after a wave
? Only level, no wave, one high and one low voltage
4. PA
Just the sound card output audio signal amplification (amplifier sound bad cause little noise, no sound)
Failure of some of the problems caused by sound card
1. Power Supply
2. Crystal
3. Sound card chip
4. PA
5. Sound card and amplifier small capacitor around
6. CMOS setting error will cause silent, not the sound card installed
7. BIOS Bad


NOT NEED THE MOTHERBOARD SERVICE MANUAL FOR ASUS,GIGABYTE,MSI FOLLOW ABOVE STEPS

Motherboard routine maintenance of 23 cases

Today, more and more integrated motherboard, motherboard repair has become increasingly difficult, often using specialized digital testing equipment to complete. However, some motherboards do not require specialized common faults detection equipment, your own hands can be resolved, following are some of the most typical example of a motherboard failure repair and hope that everyone will learn the basic approach to solve the motherboard failure.

First, boot no display type fault

【Example 1】: motherboard does not start, boot-free shows that the memory alarm sound ( "Didi" to call a non-stop)

Cause of the malfunction: Memory alarm failure is more common, is mainly caused by poor contact of memory. For example, non-standard memory, the memory of a bit thin, when the memory into the memory slot, leaving some gaps; memory of the finger technique is poor, the surface of gold-plated cheat poor over time, Finger surface oxide layer gradually thickened, leading to poor contact memory; memory slot of poor quality, reed contact with the memory of the finger is not really so.

Approach: Open box, with rubber carefully wipe the memory clean of the finger to get down and re-insert memory look, with hot melt adhesive to the memory slots on both sides of the gap filled to prevent oxidation of the use of the process to continue. Note: In-swappable memory be sure to unplug the power cord off the host, to prevent accidental burning of the memory.

【Example 2】: motherboard does not start, boot no display, there are graphics alarm sound (a long two short tweet)

Cause of the malfunction: Normally, graphics card loose or damaged. Approach: Open box, put a good graphics card can be re-inserted. To check the AGP slot if there were a small foreign body, otherwise it would be graphics card will not plug in place; the board for the use of voice alarm should be careful to distinguish the contents of the voice prompts, and then solve the corresponding failure based on content.

If the above approach even after the police, it could be bad graphics chips, and replace or repair card. If the boot after the hear "tick," gave the self-test passed, but that did not display the normal image, put the card inserted in the other motherboard, use the normal, that is, graphics are not compatible with the motherboard, graphics card should be replaced.







【Example 3】: motherboard does not start, boot no display, no alarm sound

Failure reason: There are many reasons, mainly the following.

Approach: For the following reasons, one by one to exclude. Ask you are familiar with digital circuit analog circuit, will use the multimeter, and sometimes also need to check with DEBUG card failure.

(1) CPU issues

CPU no electricity: multimeter test CPU can be used around the three (or a) field pipe and three (or a) rectifier diode, check the CPU for damage.

CPU socket pins are missing or loose: the performance of such failures as the point does not light or non-crash. Need to open the surface of the superstructure of the CPU socket, carefully observe with your eyes whether the deformation of the pin.

CPU fan socket fixed clamp fracture: You can consider the use of other fixation methods, generally do not replace the CPU socket, because the left hand soldering easier to hidden failures. SOCKET370 of the CPU, its fixed the radiator through the CPU sockets, if the fixed leaf spring too tight, demolition must be careful when, otherwise it will cause a plastic clamp fracture, there is no way a fixed CPU fan.

CPU frequency CMOS settings wrong inside: as long as you can clear the CMOS to solve. Clear CMOS jumper on the motherboard in general vicinity of the lithium batteries, its default location is generally 1,2 short, as long as its changed for the 2,3-short jump a few seconds you can solve the problem, for the previous old motherboard, such as the finding does not to the jumper, as long as the battery removed, to be displayed into the CMOS settings and then boot off the battery to install up will also allow CMOS discharge.

(2) motherboard expansion slot or an expansion card problem

Because the motherboard or expansion card expansion slot problems, leading to plug in graphics cards, sound cards and other expansion cards, the motherboard does not respond, thus creating a boot no display. For example, brute-force disassembly AGP graphics card, resulting in cracking AGP slot, you can cause such failures.

(3) memory problems

Motherboard does not recognize the memory, memory corruption or memory does not match: Some older motherboards more selective memory, once the plug in the motherboard does not recognize the memory, motherboards, will not start, and even some motherboards do not fault tips (tweet). In addition, if the plug in different brands, types of memory, and sometimes lead to such failures.

Memory slots Broken Needle or burning: sometimes because of excessive force or improper installation method will cause deformation of the memory slot of the spring break, so that the memory slot scrapped. Note: Plug memory should be the vertical force, do not shake around. In the swap memory before the host must unplug the power to prevent the use of STR function, memory, live, burning memory. In addition, do not install anti-memory, and to avoid power-up and burned in memory. But now the motherboard, generally foolproof will be designed to insert anti-.

(4) The motherboard BIOS is damaged

The motherboard BIOS the hardware store important data, while the motherboard BIOS is the more vulnerable parts susceptible to damage, once damaged it will cause the system to not run.

Such failures usually occur because the motherboard BIOS has been caused by CIH virus attack. In general after the virus destroyed BIOS, hard disk where data will be all lost, you can detect the hard disk data is intact, in order to determine whether the BIOS has been damaged; in a time when DEBUG card can also be through the BIOS on the card indicator light to determine whether the . When the BIOS, BOOT block has not been destroyed, start after the display does not shine, PC speakers have "toot" sound the alarm; if BOOT is damaged, then, after power on, power supply and hard disk lights, CPU fan turn, but it does not start at this time only through the programmer to rewrite the BIOS.

You can also plug in ISA card, see if there is displayed (if prompted, can prompt steps below.), If there is no boot screen, you can even act as an automatic update BIOS, floppy disk, re-update BIOS, but there are The motherboard BIOS is damaged, the floppy drive simply does not work, at this time recommend to service providers, device will be used to write code to write BIOS in the BIOS update file.

(5) CMOS battery problem using the

Press the power switch, hard drive and power lights, CPU fan turn, but the host does not start. When, after removing the battery, you can start normally.

(6) The board automatically protect lock

Some motherboard with automatic detection protection function, when the power supply voltage is abnormal, or CPU overclocking, adjusting the voltage is too high occurs, will automatically lock to stop working. Performance is what the board does not start, then the CMOS after discharge may be combined with electric start, and some motherboards need to board the power to open, hold down the RESET key to unlock it.

(7) capacitors on the motherboard is damaged

Check the capacitors on the motherboard, or whether the bubble burst. When the capacitor voltage is too high or because of long high temperature BBQ will bubble or drip fluid, when the capacity of capacitance decrease or loss of capacity, capacitance will lose filtering function, the provision of load current to increase the exchange of components , resulting in CPU, memory, and the relevant board job insecurity, manifested as easy to hang or system instability, often a blue screen.

【Example 4】: motherboard temperature control disorders, leading to boot no display

ASUS P3B-F motherboard can monitor the CPU temperature, using a temperature monitoring 2Pin lines, inserted in the CPU slot beside the pins on the JTP. Later, in the course of time playing the game, the machine suddenly a blue screen, reboot, wait until the CD-ROM, hard disk self-test does not actually exhausted display bright.

Failure reason: connected to the motherboard's temperature-controlled off-line, off the motherboard, causing the motherboard automatically protect the state, refused to increase power. As the CPU heat is very large, many motherboards offer a strict temperature control and protection devices. General CPU temperature is too high, or on the motherboard temperature monitoring system fails, the motherboard will automatically enter the protection. Refuse to power-start, or alarm.

Approach: Re-connecting the temperature control cable, and then you can boot. Note that if your motherboard does not start properly or alarm, you should first check the motherboard temperature monitoring devices are normal.

2, CMOS type fault

【5】 examples: Computer frequently crashes, conducting crash CMOS settings will appear the phenomenon of

Cause of the malfunction: is generally bad or motherboard motherboard design thermal problem caused by Cache.

Approach: If the heat is not good enough because of the motherboard caused the failure, you can touch the CPU after the crash around the motherboard components, you will find that the temperature is very hot, in the replacement of high-power fans, the crash failure can be resolved.

If it is a problem caused by Cache, you can enter the CMOS settings, immediately after the Cache prohibited. Of course, Cache ban, the machine speed would certainly be affected. If the fault can not be resolved according to the law, it is motherboard or CPU have problems, only to replace the motherboard or CPU.

【6】 examples: CMOS parameters of the loss, after the boot prompt "CMOS Battery State Low", and sometimes you can start to use some time after the crash.

Cause of the malfunction: This phenomenon mostly due to power shortages in CMOS.

Approach: If it is welded battery, you can re-power soldering iron can be welded on a new battery; if it is button-type battery can be replaced; if it is chip-type battery, you can replace the chip, preferably in the same type chip replacement.

If you replace the battery, the time is not long, suffers from a similar phenomenon, it is likely to be board leakage, you can check the diodes, or capacitors on the motherboard is damaged, you can also use an external battery jumper.

【7】 examples: CMOS settings can not be saved

Cause of the malfunction: is generally caused due to lack of motherboard battery approach: replacement of the battery can. If you have the battery replaced the motherboard, but also solve the problem, you should check the motherboard CMOS jumper have any questions, sometimes because it would be wrong on the motherboard CMOS jumper set to clear the option, or set to an external battery, will be made CMOS data can not be saved. If not the above reasons, you can determine that the circuit board there are problems, I suggest you look for professional repair.

【8】 examples: Board anti-virus does not shut down, resulting in the system can not be installed

Install Win98 initial stage, the screen suddenly appeared on a black rectangular area, such as what prompt, and then stop installed. Adjust the display brightness and contrast switches are also invalid, killing the virus with anti-virus software and did not find any viruses.

Failure Cause: This behavior is easier to buy in the new motherboard, because by default, the new motherboard BIOS in the anti-virus is set mostly Enabled, it will appear similar to the failure.

Approaches: carefully read the motherboard manual. Into the CMOS setup program, the "BIOS Features Setup" (BIOS feature set) in the "Virus Warning" (Virus Warning) option from the "Enabled" (allow) set to "Disabled" (Prohibition), you can solve the problem .

【9】 examples: Installing Windows, or start Windows when the mouse is not available

A old 586 computer, install Windows, or when you start Windows the mouse is not available to replace a good mouse, the fault is still not be excluded. Suspected to be board PS / 2 mouse interface failure, to get the professional board test points, check the PS / 2 mouse port to normal.

Cause of the malfunction: CMOS parameter errors caused by IRQ settings. Such failure is common in the old 586 computer, new motherboard generally will not have this problem.

Approach: In the CMOS settings, power management field, there is a Modem use IRQ project, options were 3,4,5 ......, NA, in general it is the default option for three, set it to 3 other than the interruption of items, you can troubleshoot.

In addition, a number of old 586 computers, COM port and LPT port is connected through a signal cable connected to the chassis outside of the signal line of the access method, with the board differ, if the access method does not also lead to the mouse is not available, their access laws generally have the following two:
(1) signal line in accordance with the order of 1 to 9, in turn connected with the connector;
(2) signal line and the connection point cross-linked above a row of connectors are connected to the signal lines 1,3,5,7,9, following a row as 2,4,6,8.


【10】 example: Cache on the motherboard is damaged

Cache on the motherboard is damaged, the performance to run the software crashes, or simply can not install the software.

Approach: in the CMOS settings, "External Cache" entry set to "Disable" after troubleshooting.

3, I / O device is not functioning properly fault

【11】 examples: board COM port or parallel port, IDE port failure

Cause of the malfunction: General is due to hot plug hardware caused by the user.

Approach: You can use multi-function card instead. But instead, you must first ban on the motherboard that comes with COM port and parallel port, pay attention to some motherboards with IDE port to be banned, before being used normally.

【12】 example: can not use the keyboard interface on the motherboard

Good to connect a keyboard, power on self test when prompted "Keyboard Interface Error" after the crash, unplug the keyboard, re-inserted to pursue a normal start the system, using the keyboard no response after a period of time.

Failure reason: plug the keyboard several times, causing loose keyboard interface board.

Approach: remove the motherboard can be a good electric soldering iron to re-. If it is charged plug the keyboard, causing a form of insurance on the motherboard of the power block (on the motherboard marked as Fn things), put on a 1 ohm / 0.5 watt resistor.

【13】 examples: integrated on the motherboard display adapter failure

The Great Wall has a computer, the boot sound 8 sound, determine display adapter failure. Open the case found that the display adapter integrated on the motherboard, nor the motherboard manual.

Cause of the malfunction: After boot ring several more, most of them do not insert a good memory, motherboard or display adapter failure.

Approach: a close look at the jumpers on the motherboard marked, shielding out the motherboard on the integrated display device, some motherboard CMOS settings need to prohibit the integrated graphics on the motherboard; and then plug in the expansion slot on the card can be good.

【14】 example: the printer parallel port on the motherboard is damaged

Of more than 486 computers, printers, parallel port integrated on the motherboard most prone to such failures, resulting in not print.

Cause of the malfunction: Charged plug the printer cable signals, most likely to cause damage to the parallel port on the motherboard.

Approach: Check whether the printer supports DOS printing, in pure DOS mode, use the DIR> PRN (only for needle and some laser printers, inkjet printers and effective), see Printing is normal; see motherboard manual, through "to prohibit or allow on the motherboard parallel port function "related to jumper, set the" mask "function on the motherboard parallel port (or through the CMOS settings to shield), and then in the ISA expansion slot you can add a multi-function card.

【15】 examples: the motherboard of soft / hard disk controller is damaged

Cause of the malfunction: from 486 started, most motherboards have integrated soft / hard disk controller, the controller damage mostly caused by electrically charged pluggable.

Approach: For the following conditions are dealt with separately.

(1) floppy disk controller on the motherboard is damaged you can change the jumper, or CMOS settings, plus a multi-function card, Gaoding.
(2) hard disk controller, a bad hard drive, if the access is less than 528MB, you can add a multi-function card,; if by then the hard disk is larger than 528MB, need to update the motherboard BIOS, or the use of relevant software.

【16】 instance: IDE connection error, can not find hard drive

A 40GB console, in a dual-drive Duikao, re-connecting to the main hard drive and boot the machine prompts can not find any IDE device, can not find the hard disk can not access WinXP. After the restart enter the CMOS setup program and found not detect any IDE devices are not detected from another hard drive.

Fault reasons: frequent occurrence of such failures. If it is not the hard disk itself is damaged, then the wrong motherboard IDE cable or IDE port is damaged, can lead to such failures. In addition, hang the hard disk, if the failure to make timely change the jumper, there will be a similar situation. The investigation in this case is caused by the errors IDE cable, ATA/100 hard drive line Slave port connected to the hard disk.

Approach: Master port can be replaced.

4, power failures category

【17】 examples: power switch or RESET key to damage boot after a few seconds automatically shut down.

Cause of the malfunction: Now a lot of switches and lights on the chassis, headphone jack, USB socket poor quality. If the RESET key is pressed after the bombs are not up, after power on because the host is always reset, so press the power switch, the host will be no response, and processing power are not the same, so the power light and hard disk light does not shine, CPU the fan not to switch.

Approach: Open chassis, repair power switch or the RESET button. Mostly on the motherboard power switching power supply, the power tubes used for the separation of the device and, if damaged, as long as the replacement power tubes, capacitors can be.






【18】 example: power supply socket with virtual access, loose

This situation is rare, may from time to time to restart the emergence of the phenomenon.

Approach: inspection can be turned on, the hand-shaking every part of the power line interface to see if there is failure phenomenon.

【19】 example: insurance resistor fuse on the motherboard

There can not find the keyboard and mouse, USB mobile devices can not be used and so on.

Fault reasons: the insurance resistor fuse on the motherboard.

Approach: determine the methods of simple, use the multimeter to measure the resistance of files off of. If that is indeed the insurance resistor fuse, you can use 0.5OHM about resistance replace.

【20】 example: Power not the machine is configured to nForce2 motherboard, Athlon XP 1700 + (overclocked to 2400 +) CPU, each boot to be repeated by several times the total "Power" button to light up the computer, and sometimes still in testing standstill when the hard disk, and restart one can usually solve the problem.

Cause of the malfunction: Athlon XP 2400 +'s power has reached 70W, while the nForce2 motherboard circuit design of the power supply stability requirements are very high.

Approach: replacement of brand-name power supply, you can troubleshoot. Chassis poor power supply, the computer will cause great harm to the various parts. Proposed nForce2 motherboard players in preparation for a 300 ~ 350W brand names (such as the Great Wall, buffalo, HuntKey, etc.) power supply. 5, hardware compatibility failures

【21】 examples: the motherboard is not compatible with the display

PC configurations for the elite P6ISA-II motherboard (i815E chipset), Samsung 750S monitor, install the driver later, when the boot display appears stripes and actually does not restart after the display of the imaging. Use substitution to replace all the parts in turn, found that when using P6ISA-II motherboard with Samsung 750S equipped with machines, fault occurs, and if the block with this motherboard compatible with the other displays, fault does not appear.

Cause of the malfunction: the motherboard is not compatible with the monitor approach: replace the motherboard or the display can solve the problem.


【22】 examples: the motherboard and memory are not compatible machines are nForce2 motherboard, added a 256MB Kingmax DDR400 (TinyBGA package) memory, and the composition of the original memory, dual-channel mode, but the added memory, the system becomes very unstable, play games from time to time when the automatic restart or crash.

Cause of the malfunction: nForce2 motherboard memory more selective about the other, Kingmax memory, and a lot of motherboards are not compatible with the existence of the problem.

Approach: nForce2 motherboard with Kingston's DDR333 (Infenion particles), DDR400 (Winbond particles), and Samsung original memory, with very good, we recommend installation of this type of memory.

【23】 example: the driver is not compatible with the motherboard in a number of brand-name motherboard, sometimes there such a phenomenon: the motherboard driver Asus after the restart the computer in normal mode does not enter the Win98 desktop, or a crash occurs, CD-ROM drive access slow phenomenon, and that the driver can not be uninstalled under Win98.

Cause of the malfunction: the motherboard and the driver is not compatible.

Approach: find the latest motherboard driver re-install, issues are generally able to resolve. If not, you can re-install the system.